Ultrasonic bonding system which is appropriate for producing power device
適用于功率模塊生產的超聲波鍵合系統
Homogeneous/Heterogeneous Metal Bonding
同類/異類金屬鍵合
It bonds heterogeneous metals well, which was hard to achieve with conventional bonding method. Needless to solder, you can bond them directly at room temperature
它可在室溫下直接鍵合異質金屬，這是傳統焊接方法難以實現的。
IGBT Module (Terminal bonding)
IGBT模塊（終端連接）
It is desirable to bond without soldering when dealing with IGBT module, which requires high temperature during operation. Ultrasonic bonds the lead on the package side and the electrode on the DBC substrate directly
在處理IGBT模塊時，無需傳統的高溫焊接。超聲波將封裝側導線和DBC基板上電極直接鍵合
產品應用案例參考：
Adwelds超聲波切割及焊接應用場景01
Adwelds超聲波切割及焊接應用場景02
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