Appropriate for forming next generation power device circuit
適合形成下一代功率器件電路
Homogeneous/Heterogeneous Metal Bonding
同類/異類金屬鍵合
It bonds heterogeneous metals well, which was hard to achieve with conventional bonding method. Needless to solder, you can bond them directly at room temperature
它可在室溫下直接鍵合異類金屬，這是傳統焊接方法難以實現的。
IGBT Module (Ribbon Bonding)
IGBT 模塊 (Ribbon Bonding)
Multiple kinds of ribbon bondings are available with multi-feeder
多喂料器可實現多種帶狀鍵合
ABB Process
Cu ribbon bonding is available by using Al as a buffer material, it gives strength to a feeble base material
使用鋁作為緩沖材料可以實現銅帶狀鍵合, 可以提高薄弱基礎材料的強度
產品應用案例參考：
Adwelds超聲波切割及焊接應用場景01
Adwelds超聲波切割及焊接應用場景02
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